Quantum-safe in-factory profile provisioning launched for IoT devices

Acceleronix, a global Internet of Things (IoT) solutions and services provider, and IDEMIA Secure Transactions, a global payment and connectivity solutions specialist, have launched the In-Factory Profile Provisioning (IFPP) Early Access Program at MWC Barcelona. 

The programme, which is delivered jointly with Tele2 IoT, provides early access to a quantum-safe IFPP solution for IoT devices. Under the programme, Acceleronix's platform, orchestration capabilities, and factory tools are combined with IDEMIA Secure Transactions' IFPP-ready eSIM IoT and quantum-safe IFPP binding and delivery of MNO profiles. Tele2 IoT contributes its profiles with managed global IoT connectivity.

The programme is tuned for any type of device manufacturing operation, from small production runs to large-scale factories. The programme enables OEMs to preload connectivity profiles onto eSIMs during the manufacturing process using one single eSIM part number (one stock-keeping unit or SKU). Devices can leave the factory ready to connect out of the box, simplifying the IoT connectivity lifecycle and accelerating global scale. 

Key benefits include automated provisioning, real-time monitoring, full traceability, simplified SKU management, and faster time to market. Built on the highest cryptographic standards and quantum-safe design, the programme protects connectivity profiles even in offline or air-gapped environments. In addition, it is compatible with future GSMA specifications, notably SGP.42, and scalable.

"Acceleronix is leading the industry with our IFPP- and SGP.32-enabled solution, our SIM orchestration, and our pan-regional IoT connectivity," said Gal Olshinka, Acceleronix Director. 

"This new IFPP Early Access Program demonstrates our commitment to eSIM technology and reflects our focus on streamlining the IoT device and connectivity lifecycle to support scalable IoT solutions. We're delighted to have collaborated with IDEMIA Secure Transactions and Tele2 IoT to create this partnership, and we're proud to bring it to MWC26 to showcase how IFPP simplifies device provisioning at scale, reduces operational risk, and enables out-of-the-box connectivity as devices leave the production line."

Philippe De Oliveira, Senior VP Auto/IoT Connectivity Services at IDEMIA Secure Transactions, added: "IFPP marks a turning point for OEMs to significantly simplify and optimise the manufacturing process for connected devices. By bringing together our expertise in connectivity solutions, in particular eSIM SGP.32, and our quantum-safe cryptography, along with Acceleronix's factory orchestration capabilities and Tele2 IoT's IoT connectivity leadership, we are proving in-factory provisioning – which is not theoretical – it is live, scalable, and ready for industrial adoption today."

"Tele2 IoT is proud to collaborate with Acceleronix and IDEMIA Secure Transactions to bring this IFPP Early Access Program to life," said Onur Kasaba, MD of Tele2 IoT. 

"By combining our managed global IoT connectivity and provisioning capabilities with in-factory profile provisioning, we're enabling OEMs to ship devices that are ready to connect straight from the factory. This approach significantly simplifies the IoT lifecycle, reduces operational complexity, and supports scalable, secure deployments worldwide."

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*OEM stands for original equipment manufacturer. SKU is an acronym for stock keeping unit.